➤ When processing sensitive materials such as copper, aluminum, and especially nickel, it ensures excellent material compatibility and does not damage the protective layer of the chip.
➤ Capable of effectively removing residues in small gaps at the bottom of components and maintaining bright solder joints after cleaning.
➤ This product is easy to rinse with deionized water, and there is no residue or whitening on the cleaned parts and cleaning equipment.
➤ The diluent has no flash point, and its formula does not contain any halogen components and has a light odor.
➤ Dilute with deionized water in a certain proportion to prevent foaming, making it suitable for ultrasonic and spray processes.
➤ The concentrated solution can be diluted in different proportions according to the difficulty of cleaning the residue before use.

Mainly used for ultrasonic and spray cleaning processes.

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