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Stencil Cleaning Stencil Cleaning
Bottom cleaning of SMT solder paste printing machine cleaning
Bottom cleaning of SMT solder paste printing machine

Bottom cleaning of SMT solder paste printing machine cleaning

To ensure the printing quality of the SMT printing machine and avoid contamination of the PCB surface with residual solder paste and solder powder from the stencil and screen, it is necessary to regularly and fixedly wipe and clean the bottom of the printed steel stencil to avoid solder paste contamination of the board surface, avoid solder beads on the board surface after welding, and ensure technical indicators such as the form, shape, and amount of solder paste for printing.

Unibright Bottom cleaning of SMT solder paste printing machine cleaning advantages

➤ Good solubility and wetting power, with good cleaning effect for fine spacing holes in the mesh plate.
➤ The formula is mild, with a neutral pH, and excellent material compatibility.
➤ Low odor and minimal impact on the environment.

Bottom cleaning of SMT solder paste printing machine cleaning recommended products

Bottom cleaning of SMT solder paste printing machine cleaning application

SMT锡膏印刷机底部擦拭

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