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SMT component clean

PCBA Cleaning
Circuit board BMS circuit board Cleaning of Automobiles ECU Server substrate

Electronics cleaning
Power LED Power module components IGBT power module

Stencil Cleaning
solder paste stencil red glue stencil Ink screen Silver slurry and silver glue cleaning

Advanced semiconductor packaging cleaning

Packging cleaning
system-in-package PoP stack chip Flip chip Wafer level packaging

Chip cleaning
Semiconductor Packaging COB Bonding Camera and fingerprint module

Leadframes Cleaning
Discrete device Lead frame

Flux + Device application

Maintenance
Chain claw Cleaning of condenser and filter screen SMT furnace Cleaning of fixtures and carrier

Fluxes
Wave soldering flux Component soldering flux Chip flux

Device application
Fully automatic fixture and carrier Fully automatic ultrasonic stencil Fully automatic ink screen

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SMT component cleaning process
PCBA circuit board cleaning,cleaning of precision electronic components

Advanced semiconductor packaging and cleaning process
Advanced packaging cleaning, chip residue removal

Power electronics cleaning process
IGBT power module, lead frame, discrete devices

Cleaning process optimization
Optimize cleaning process and improve cleaning quality

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After sales issues

Need any training or coaching of cleaning process?

Please contact the corresponding technical engineer. If there is no engineer contact number, please call 136-9170-9838 to contact customer service for consultation.

Poor cleaning or after cleaning residual of components?

1. The usage concentration is low and needs to be increased.

2. The cleaning temperature is low and does not meet the specified usage temperature, requiring heating.

3. The cleaning agent model does not match and needs to be changed.

For other questions, please contact us at 136-9170-9838.

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火星电竞·(CHINA)官方网站